dicing-scribing header image

Mobius Photonics produces UV and green laser sources featuring short pulses, high pulse energy, and high repetition rates for applications such as < 50 micron wafer dicing and scribing low-K substrates.

Materials processing tool makers and high-volume manufacturers are continually developing and improving equipment and processes to accommodate ever more demanding requirements. The goals for dicing and scribing applications are consistent, efficient material removal with a minimal heat affected zone (HAZ) and extremely rapid throughput.

Mobius builds fiber-based laser sources suited for dicing and scribing applications. Our sources can be configured to generate either infrared, ultraviolet (UV) or green output. They emit short, high-energy, high-repetition-rate pulses with excellent beam quality. When demonstrated for silicon wafer dicing, our systems have produced material die strength properties similar to those of mechanical sawing methods, but with the high cut quality and rapid throughput offered by laser technologies.

To learn more about our laser sources for dicing and scribing, please contact sales@mobiusphotonics.com.