Mobius Photonics produces UV and green laser sources featuring short pulses, high pulse energy, and high repetition rates for applications such as < 50 micron wafer dicing and scribing low-K substrates.
Materials processing tool makers and high-volume manufacturers are continually developing and improving equipment and processes to accommodate ever more demanding requirements. The goals for dicing and scribing applications are consistent, efficient material removal with a minimal heat affected zone (HAZ) and extremely rapid throughput.
Mobius builds fiber-based laser sources suited for dicing and scribing applications. Our sources can be configured to generate either infrared, ultraviolet (UV) or green output. They emit short, high-energy, high-repetition-rate pulses with excellent beam quality. When demonstrated for silicon wafer dicing, our systems have produced material die strength properties similar to those of mechanical sawing methods, but with the high cut quality and rapid throughput offered by laser technologies.
Green and UV wavelengths.
We offer 532-nm sources and 355-nm sources for efficient material removal.
With pulses in the 2- to 6-nanosecond range, our lasers demonstrate thorough ablation with a minimal HAZ.
High repetition rates.
Our high-power system features repetition rates from 200 kHz up to 2 megahertz, enabling fast throughput.
High pulse energies.
Our high-power UV source generates as high as 150 microjoules per pulse; high-power green up to 225 microjoules per pulse, allowing thorough material removal per pulse.
Excellent beam quality.
Mobius' master oscillator fiber power amplifier (MOFPA) design demonstrates excellent beam quality and pointing stability, allowing clean cuts and small feature sizes. Our sources' beam parameters are also constant over all operating ranges.
Preserves material strength; produces high-quality cuts.
For silicon wafer dicing, our lasers demonstrate a die strength similar to mechanical sawing, but with the speed and precision of a laser.
To learn more about our laser sources for dicing and scribing, please contact email@example.com.