2010
Jan. 13, 2010: Mobius Photonics Delivers Upgraded Fiber Laser for STED Microscopy
Apr. 1, 2010: Mobius Photonics Featured in Arena Solutions' Blog
May 20, 2010: Mobius Photonics’ Monro to Give Presentation at CMOS Emerging Technologies Workshop
May 21, 2010: Consultant to Mobius Photonics Discusses Company’s Patent Licensing at CLEO 2010
Jul. 6, 2010: Mobius Photonics Develops “Meight” Optical Fiber Connector
Sep. 1, 2010: Mobius Photonics’ Byer Quoted in Design News Article
2009
Jan. 28, 2009:
Mobius Photonics, Inc. CEO, Laura Smoliar, featured in Semiconductor Packaging News
May 26, 2009:
Mobius Photonics, Inc. to Exhibit at Laser World of Photonics in Munich
Jun. 28, 2009:
Mobius Photonics Changes Leadership
Sep. 10, 2009:
Mobius Photonics Co-Founder to Speak at PLM Network Event
Sep. 15, 2009:
Mobius Photonics Names Robert L. Mortensen CEO
Sep. 30, 2009:
Mobius Photonics Laser System Used in STED Microscopy Experiments at Max Planck Institute
Oct. 14, 2009:
Mobius Photonics Names Robert L. Byer Chairman of the Board
Nov. 2, 2009:
Mobius Photonics Co-Founder to Present Paper at ICALEO
Dec. 8, 2009:
Mobius Photonics Laser Demonstrated for Precision Materials Processing
Dec. 22, 2009:
Mobius Photonics Moves to New Facility
2008
Dec. 2, 2008:
Mobius Photonics, Inc. Appoints Japan Distributor Kantum Electronics Company, Ltd.
Dec. 10, 2008:
Mobius Photonics, Inc. to Deliver UV Results at SPIE Photonics West 2009
Dec. 15, 2008:
Mobius Photonics, Inc. Awarded U.S. Patent for Design Enabling High-Throughput Parallel Laser Processing
December 8, 2009
Mobius Photonics Laser Demonstrated for Precision Materials Processing
MOUNTAIN VIEW, Calif., December 8, 2009 - Mobius Photonics, an innovative producer of short pulsed fiber laser sources (IR, green, and UV laser), has demonstrated a fiber laser tailored for precision materials processing. The Mobius Photonics laser produces high-quality, micron-scale cuts, scribes and holes for applications such as 50 micron silicon wafer dicing (for memory), scribing glass substrates and polyimide hole drilling.
"A goal of ours has been to construct a fiber laser that outperforms competitive methods for high-precision materials processing," said Manuel Leonardo, Mobius Photonics vice president of technology. "We've now demonstrated a laser that produces high-quality features in a variety of materials. Ultimately, we aim to improve a host of manufacturing applications in terms of speed, output quality and consistency."
While diode-pumped solid-state (DPSS) lasers have been evaluated for thin wafer dicing, their use has been hampered due to the die strength data; typically, 50 micron wafers diced with DPSS ultraviolet (UV) lasers have produced dies with significantly lower break strength vis a vis conventional mechanical methods. Said Leonardo, "Our laser is able to produce a similar high-quality cut and resulting die strength as conventional mechanical methods. It also cuts faster than mechanical methods and avoids the random chipping that those systems often create."
The Mobius Photonics laser also produces smooth, continuous scribe lines in glass substrates and generates 1-micron-diameter, uniform through holes in 25-micron-thick polyimide. Mobius Photonics' laser is based on an all-fiber-amplifier, master-oscillator, power amplifier (MOPA) architecture. This versatile, nanosecond source can produce several wavelengths and supports various pulse repetition frequencies and pulse widths.
About Mobius Photonics
Founded in 2005, Mobius Photonics, Inc. produces fiber-based laser sources for applications ranging from material processing for solar cell manufacturing, semiconductor fabrication and assembly, and flat panel display manufacturing, to scientific uses such as STED microscopy. The Mobius Photonics team combines in-depth understanding of customer needs with manufacturing experience, and pushes the state-of-the-art by working in close collaboration with suppliers and customers around the world.
Contact
Press@mobiusphotonics.com
541-928-8996 or 408-496-1084