products

Applications

The G1+ Laser System product family addresses commercial materials processing applications, especially semiconductor and microelectronics processing. Application areas include, but are not limited to, the following:

Materials Processing

  • Wafer scribing and dicing
  • Low-k dielectric scribing
  • Solar cell scribing and cutting
  • Circuit trimming
  • Link blowing
  • Sapphire scribing
  • Ceramics processing
  • Flat panel fabrication and repair
  • Other ablative processes

Precision Manufacturing

  • Micro-welding
  • Wire bonding (especially gold / copper)
  • Photoresist patterning

Micromachining

  • Micro-via drilling
  • Marking

Medical

  • Surgical
  • Device manufacturing

The system's unique capability to rapidly change pulse repetition frequency and pulse width enables a single system to readily process multiple materials or composite structures.

Detailed data sheets available upon request. Would you like to learn more about our products? Contact us at sales@mobiusphotonics.com.

Read More...

applications